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Semiconductor Equipment Corp. Model 8601 Manual Die Bonder Semiconductor System 153444677213 Includes AC Servo Motor Drive

SKU: 54785459072
4.2
USD4749.99 USD4797.99

Pay in 4 interest-free payments of $1187.50 Learn more

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Sep 10 - Sep 15

Description

Includes AC Servo Motor Drive as pictured

Flexible Fieldbus Connectivity:

Manufacturer Tektronix Model Number AWG430 SKU 19-44927 Ref 23-102143

Manufacturer UVEXS Part Number SCU 110B Model Number 13197B SKU 19-59459 Ref 23-84673

The wear is only physical and does not affect the functionality of the Communications Analyzer

Semiconductor Equipment Corp. Model 8601 Manual Die Bonder Semiconductor System 153444677213 Includes AC Servo Motor DriveThis item will ship motor freight. Condition Used Description Includes: Semiconductor Equipment Corp. Model 8601 Manual Die Bonder Semiconductor System Omega DPi8 2x 8601 052 REV D Schott Fostec 20500 3x Panasonic GP KR222 Leica MZ95 Optem Controller A. G. Heinze DL 150 Gast DOA P704 AA Sylvania display Optem Stepping Motor Junction Box 30 17 74 Ushio 21V150W Halogen Reflector Lamp RadioShack 15 1982 Video Selector Dell Keyboard Viteris SPR Push

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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